Applications

AI / DATACOM

Explosive growth in AI workloads and data center traffic demands optical systems capable of delivering higher bandwidth, lower power consumption, and seamless scalability. HyperLight’s TFLN Chiplet™ platform directly addresses these market needs, enabling optical system upgrades from today’s 100G and 200G per lane IMDD technology to future-ready 400G per lane solutions. With built-in compatibility for advanced 2.5D and 3D integration, our platform ensures datacenters remain ahead of rapidly evolving infrastructure requirements, maximizing performance, energy efficiency, and market competitiveness.

DCI / TELECOM

Data Center Interconnect (DCI) and telecom networks increasingly require compact, reliable solutions capable of supporting ultra-high-speed communication. HyperLight’s TFLN Chiplet™ platform directly addresses this market need, providing dual-polarization IQ transmitter chips designed for data rates of 130, 200, and 260 Gbaud. Featuring ultra-low optical losses, small footprints, and exceptional long-term stability, our integrated IQ Tx chips help telecom and DCI providers achieve higher bandwidth density, increased reliability, and reduced power budgets—crucial for next-generation coherent communication networks.

Test and Measurement

The rapid growth of high-speed networks and advanced communications creates stringent requirements for precise, reliable, and high-bandwidth test solutions. HyperLight’s TFLN Chiplet™ platform directly addresses this need, delivering modulators with electro-optic performance up to 110 GHz. Trusted by industry leaders for applications including 400G/lane data-center testing, 260 Gbaud coherent system evaluation, 145 GHz photodetector characterization, and advanced EO conversion, our TFLN modulators provide unmatched accuracy, stability, and ultra-low optical loss—setting the benchmark for next-generation test and measurement solutions.

Quantum Computing

Quantum computing promises revolutionary advances in information processing, demanding integrated photonics solutions with ultralow optical losses, broad wavelength coverage, and scalable production capabilities. HyperLight’s TFLN Chiplet™ platform uniquely addresses these requirements with intrinsic low-loss optical waveguides, wide spectral transparency (UV to mid-IR), and ultrafast electro-optic modulation.

We actively collaborate with quantum partners to explore and accelerate both near-term quantum innovation and long-term quantum computing realization. Our scalable manufacturing approach ensures synergy across applications, enabling quantum technologies to benefit from the rapid scaling of AI and datacom industries.

Emerging Applications

HyperLight’s TFLN Chiplet™ platform is designed to empower innovation in next-generation optical technologies. We actively collaborate with customers to explore and accelerate emerging applications, recognizing that today’s research will drive tomorrow’s breakthroughs. Our expertise in design, simulation, manufacturing, and testing supports development efforts aimed at future opportunities, including:

• AR
• Sensing
• LIDAR
• Microwave Photonics
• Navigation

HyperLight remains committed to nurturing these emerging fields, enabling our partners to pioneer new solutions as future markets evolve.