Application Specific PIC through Multi-Project Wafers (MPW)
HyperLight’s scalable photonic integrated circuits (PICs) provide disruptive advantages for customers needing high bandwidth and low power electro-optic solutions, including data center, telecommunications, radio communication, sensing, and LiDAR applications. Using a streamlined rapid prototyping to volume manufacturing process, the PICs are customized and are produced in volume based on their specific use. Example configurations include […]